(SPIDER Automation) Sipeed Tang Primer 25K Core Board | Gowin GW5A RISC-V FPGA SoM with 64Mbit Flash & MIPI D-PHY

Sipeed Tang Primer 25K Core Board | Gowin GW5A RISC-V FPGA System-on-Module | For Portable Embedded & Display Prototyping

Description

SPIDER Automation Sipeed Tang Primer 25K SoM Board is a cutting-edge, highly integrated FPGA module designed to push the boundaries of compact hardware development. Built around the Gowin GW5A-LV25MG121 FPGA, this System-on-Module seamlessly combines high logic density, non-volatile 64Mbit SPI flash memory, and an efficient DC-DC power supply into a minuscule footprint smaller than a standard coin.

Designed for effortless system integration, the board utilizes a robust Board-to-Board (BTB) connector layout that exposes 76 versatile GPIOs, a hard-core 4-lane MIPI D-PHY interface for high-speed video applications, and three regulated power outputs. Requiring only a clean 5V supply to power the module, the Tang Primer 25K offers developers an exceptional, pocket-sized platform for building custom RISC-V processors, portable hardware accelerators, and advanced display controllers.

Key Features

• Gowin GW5A-LV25MG121 FPGA: High-performance programmable logic core tailored for efficient resource utilization and open-source or vendor toolchains.
• Hard-Core MIPI D-PHY: Integrated 1x 4-lane MIPI D-PHY interface supporting high-bandwidth camera inputs and high-resolution LCD displays.
• 64Mbit SPI Flash Storage: Onboard non-volatile memory dedicated to rapid configuration and bitstream storage.
• High-Density BTB Connector: Secure board-to-board connector supplying seamless access to 76 user GPIOs and system signals.
• Integrated DC-DC Power Regulation: Advanced onboard power circuitry delivering three distinct power output lines alongside core regulation.
• Coin-Sized Ultra-Compact Form Factor: Engineered for space-constrained wearable, mobile, and embedded carrier board designs.

Benefits

• Minimalist Integration: Easily mount the SoM onto a custom carrier board using high-density BTB connectors without cluttering your layout.
• Advanced Video Connectivity: Leverage the hard-core MIPI D-PHY interface to interface directly with mobile screens and camera sensors.
• RISC-V & Soft-SoC Ready: Ideal platform for running embedded soft-core processors and custom hardware accelerators in mobile form factors.

Applications

• Portable Vision Systems: Mobile camera interfaces, machine vision edge nodes, and high-speed display controllers utilizing MIPI D-PHY.
• RISC-V Embedded Computing: Custom microcontroller development boards and low-power IoT coprocessors.
• Wearable & Space-Constrained IoT: Compact smart hardware devices requiring dense logic integration in minimal physical space.
• Educational & R&D Prototyping: Rapid evaluation of Gowin FPGA architectures and modern mobile HDL designs.

Package Includes

• 1 x Sipeed Tang Primer 25K Core Board (GOWIN GW5A RISC-V FPGA Development Board with PMOD / SDRAM support)

Technical Specifications