SPIDER Automation Seeed SoM – STM32MP157C System-on-Module | Dual ARM Cortex-A7 & Cortex-M4 | For Advanced Embedded & IoT Prototyping

Description

SPIDER Automation Seeed SoM – STM32MP157C System-on-Module offers engineers, system integrators, and product developers a compact, highly reliable computing core designed for high-performance edge computing and industrial automation. Derived from the ODYSSEY – STM32MP157C architecture, this module leverages a heterogeneous multi-core processor featuring dual 32-bit ARM Cortex-A7 cores running at 650 MHz for Linux operating systems, alongside a dedicated 32-bit ARM Cortex-M4 co-processor with FPU/MPU for real-time task execution and deterministic control.

The module integrates all essential core components onto a single compact board, including the STM32MP157C MPU, STPMIC1A power management IC, 512MB DDR3 RAM, and 4GB eMMC flash memory. It breaks out rich interface peripherals such as Gigabit Ethernet, Wi-Fi/BLE wireless communication, USB host ports, MIPI-DSI display interfaces, audio support, and a DVP camera port. By mounting this SoM onto a custom carrier board, developers can drastically accelerate time-to-market for complex embedded devices, gateways, and industrial human-machine interfaces (HMIs).


Key Features

  • Heterogeneous Multi-Core MPU: Powered by the STM32MP157C featuring dual ARM Cortex-A7 cores (650 MHz) and an ARM Cortex-M4 real-time coprocessor with FPU/MPU.
  • Integrated Power Management: Features the STPMIC1A PMIC ensuring efficient, regulated power delivery across all internal core rails.
  • High-Speed Memory Configuration: Equipped with 512MB DDR3 RAM and 4GB eMMC flash memory for robust operating system booting and application storage.
  • Gigabit Ethernet Connectivity: Onboard high-speed Ethernet controller support for reliable wired local network and industrial communication.
  • Wireless Connectivity: Integrated Wi-Fi and Bluetooth (BLE) modules enabling seamless IoT cloud connectivity and wireless peripheral pairing.
  • Advanced Display & Vision Support: Features a MIPI-DSI display interface for high-resolution HMIs and a DVP camera port for machine vision systems.
  • Rich USB & Audio Peripherals: Provides comprehensive USB Host interfaces and audio support for multimedia and peripheral expansion.
  • Open-Source Software Ecosystem: Backed by open-source hardware references, SDKs, APIs, Board Support Packages (BSPs), and Linux OS support.

Benefits

  • Accelerated Carrier Board Development: Offloads complex high-speed BGA routing and power sequencing, allowing designers to focus on custom carrier board features.
  • Dual-OS & Real-Time Execution: Enables running feature-rich Linux applications on the Cortex-A7 cores while simultaneously executing low-latency real-time control routines on the Cortex-M4.
  • Compact Form Factor: Integrates processor, RAM, flash, and power management into a minimal footprint suitable for space-constrained industrial gear.
  • Scalable IoT Connectivity: Onboard wireless modules and Gigabit Ethernet provide immediate local network and cloud integration capabilities.
  • Robust Industrial Reliability: Professional industrial-grade component selection ensures long-term operational stability in demanding environments.

Applications

  • Industrial Automation & HMIs: Smart factory operator terminals, decentralized control nodes, and industrial gateway controllers.
  • Edge AI & Smart Vision Systems: Machine vision inspection units utilizing the DVP camera interface and high-speed processing cores.
  • IoT Gateways & Routers: Bridging local sensor networks to cloud platforms via Gigabit Ethernet and wireless Wi-Fi/BLE links.
  • Medical & Diagnostic Devices: Portable medical instrumentation requiring rich graphical displays (MIPI-DSI) and reliable real-time monitoring.
  • Smart Home Automation Hubs: Centralized residential controllers managing appliances, audio, and sensor arrays.

Package Includes

  • 1 x Seeed SoM – STM32MP157C (Integrated Cortex-A7 plus Cortex-M4 Module)

Technical Specifications

Parameter Specification
Brand / Series SPIDER Automation / Seeed Studio ODYSSEY SoM Series
Item Type System-on-Module (SoM) & Embedded Microprocessor Board
Model Order Code / SKU STM32MP157C-SOM / SKU-SPIDER-STM32MP157C-SOM
Silicon Manufacturer STMicroelectronics
Main Processor (MPU) STM32MP157C (Dual-Core 32-bit ARM Cortex-A7 @ 650 MHz & ARM Cortex-M4 with FPU/MPU)
Power Management (PMIC) STPMIC1A Integrated Power Management IC
System RAM 512 MB DDR3 RAM
Non-Volatile Storage 4 GB eMMC Flash Memory
Networking & Wireless Gigabit Ethernet Interface & Onboard Wi-Fi / Bluetooth (BLE)
Display & Camera Interfaces MIPI-DSI Display Interface & DVP Camera Port
Software Support Linux OS, SDK, API, and Board Support Packages (BSP)
Package Shipping Weight 0.02 kg (20 g)
Package Shipping Dimensions 8 cm × 6 cm × 3 cm

Refund Reason