Description
Upgrade your 3D printer’s power management with the MOS25 25A Power Expansion Module. Specifically designed for high-power heated beds, this module allows for precise PID control—something standard DC-DC relays simply cannot handle. By offloading the high-current load from your controller board, it effectively prevents connector burnout and ensures long-term system reliability.
Featuring a unique, high-efficiency “snowflake” heatsink design, this module operates reliably without the need for additional active cooling, even under heavy loads. Whether you are using an Anet, RAMPS, or any custom 3D printer build, the MOS25 is the essential solution for handling heat beds exceeding 150W.
Key Features
- PID-Ready Control: Allows for superior temperature stability on your heated bed compared to standard relay modules.
- High-Current Protection: Specifically engineered to prevent burning out your mainboard’s connectors by managing loads up to 25A.
- Superior Cooling: Unique snowflake heatsink design ensures excellent thermal dissipation and long-term stable operation.
- Wide Compatibility: Perfectly suited for 12V to 50V systems; compatible with Anet, RAMPS, RepRap, and most major 3D printer boards.
- Ready-to-Install: Comes with a pre-included connecting cable for a quick and seamless setup.
Package Includes
- 1 x MOS25 12–50V 25A Heat Bed Power Expansion Module
- 1 x Connecting Cable (0.3m)
Technical Specifications
| Parameter | Specification |
|---|---|
| Max Current Capacity | 25A (Stable long-term) |
| Input Voltage | 12V – 50V DC |
| Dimensions | 70 x 45 x 35 mm |
| Cable Length | 0.3 meters |
| Materials | Metal, Plastic |
