SPIDER Automation PI48 Aluminium Heat Sink for TO-220 ICs | Compact 6-Fin Passive Cooling Component
Description
The SPIDER Automation PI48 Aluminium Heat Sink is a compact passive thermal-management component designed for compatible TO-220 package integrated circuits and power semiconductor devices. It helps transfer heat generated during component operation into the surrounding air, reducing thermal accumulation around the mounted device.
Manufactured from aluminium, the PI48 features a six-fin cooling profile that increases the exposed surface area for heat dissipation. Its compact 25 × 24 × 16mm form factor supports integration into PCB assemblies and electronic enclosures where space is limited. The 2mm-thick base plate provides the contact surface for mounting a compatible semiconductor package.
This heat sink is intended for passive cooling applications in power electronics, voltage regulation circuits, switching devices and embedded electronic systems. Actual thermal performance depends on component power dissipation, mounting contact, thermal interface material, ambient temperature and available airflow.
Key Features
- TO-220 Package Compatibility: Designed for compatible TO-220 package ICs and power semiconductor devices.
- Aluminium Heat Transfer: Aluminium construction provides a thermal path from the mounted component to the heat sink surface.
- Six-Fin Structure: Six cooling fins increase the surface area exposed to surrounding air.
- Compact Mechanical Profile: The 25 × 24 × 16mm dimensions support installation in compact electronic assemblies.
- 2mm Base Plate: Provides a base surface for thermal contact with a compatible device.
- 1mm Fin Thickness: Provides the specified fin construction for the six-fin cooling arrangement.
- Passive Cooling Operation: Dissipates heat without requiring electrical power or an active cooling fan.
- PCB Assembly Integration: Suitable for use in electronic circuits requiring additional thermal management for mounted semiconductor devices.
Thermal Design & Construction
The PI48 uses an aluminium body with a base plate and six fins. Heat generated by a semiconductor device is transferred through the mounting interface into the aluminium structure. The fins provide additional exposed surface area through which heat can dissipate into the surrounding environment.
For effective thermal transfer, the heat sink must make suitable contact with the component’s intended mounting surface. A compatible thermal interface material may be used where appropriate to reduce contact resistance. The heat sink’s suitability should be assessed against the semiconductor’s power dissipation and thermal limits.
Applications
- TO-220 Voltage Regulators: Passive cooling for compatible TO-220 linear voltage regulator devices.
- Power Transistors: Thermal management for compatible TO-220 power transistor packages.
- MOSFET Circuits: Heat dissipation for suitable TO-220 MOSFET devices in switching and control circuits.
- Power Supply Boards: Additional cooling for semiconductor components used in power supply assemblies.
- DC-DC Converter Circuits: Thermal management for compatible power semiconductor components in converter designs.
- Motor Driver Electronics: Cooling support for compatible TO-220 devices used in motor-control circuits.
- Battery Management Electronics: Thermal management for suitable semiconductor devices in battery-control assemblies.
- Switching Regulator Circuits: Passive cooling for compatible power components in switching regulator designs.
- Embedded Control Boards: Cooling support for power devices integrated into embedded electronic systems.
- Industrial Control Electronics: Thermal management for compatible semiconductor components in control equipment.
- LED Driver Circuits: Heat dissipation for suitable TO-220 power components used in LED driver assemblies.
- Electronic Prototyping: Thermal management during development and testing of compatible power-electronic circuits.
Package Includes
- 1 × PI48 Aluminium Heat Sink
Product Specifications
| Parameter | Specification |
|---|---|
| Product Type | Passive Aluminium Heat Sink |
| Model | PI48 |
| Intended Package Type | TO-220 |
| Material | Aluminium |
| Cooling Method | Passive air-cooled heat dissipation |
| Number of Fins | 6 |
| Length | 25mm |
| Width | 24mm |
| Height | 16mm |
| Mounting Area | 20 × 25mm |
| Fin Thickness | 1mm |
| Base Plate Thickness | 2mm |
| Product Weight | 18g |
| Package Quantity | 1 piece |
Installation & Operating Recommendations
- Check Package Compatibility: Confirm that the semiconductor uses a compatible TO-220 package and that its mounting face aligns with the heat sink’s mounting area.
- Ensure Proper Thermal Contact: Keep the component contact surface and heat sink base clean and use a suitable thermal interface material where required.
- Use Suitable Mounting Hardware: Secure the component and heat sink using appropriate hardware without applying excessive mechanical force.
- Check Electrical Isolation: Verify whether the semiconductor’s metal tab is electrically connected to a terminal. Use a suitable insulating pad and shoulder washer if electrical isolation from the heat sink is required.
- Allow Airflow: Maintain sufficient clearance around the fins so heat can dissipate into the surrounding air.
- Verify Thermal Requirements: Evaluate the component’s power dissipation, junction-temperature limit, ambient temperature and heat sink thermal performance before finalising the design.
- Check Enclosure Clearance: Ensure the 16mm heat sink height and overall mounting arrangement fit within the available enclosure space.
- Monitor Operating Temperature: Check component and heat sink temperatures under representative operating loads to confirm that the cooling arrangement is adequate.
